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Wafer Inspection
Inspection Module HE-WI-04
Loading Devices
Wafer Sorting
Factsheets

Wafer Inspection

 

The Hennecke Systems Wafer Inspection Module HE-WI-04 measures mono and multi crystalline wafer from 125mm x 125mm up to 210mm x 210mm (rectangular or pseudosquare). The system uses only non-contact measurement methods. The transport is done at a constant speed. This minimizes the stress on the wafer as much as possible.

Productivity: 3.600 wafer/h (size 156)

The following parameters are measured with high accuracy:

- Thickness, TTV
- Saw marks
- Edge defects
- Chip
- Resistivity
- Stain
- Micro Crack / Inclusions
- Geometry
- Sori, Bow
- Lifetime
- Grain size

Micro Cracks and SiC inclusions

Hennecke Systems uses an infrared based technology to detect Micro Cracks and SiC Inclusions.

It can inspect mono and multi wafer.

Short facts:

  • Infrared based technology for best detection of micro cracks and
    SiC inclusions available on the market
  • Highest market share of Hennecke in the field of micro crack detection
  • Most efficient tool to save cost in the cell production because of less broken wafers

Stain Detection

Hennecke Systems uses a special illumination to detect stain.
This guarantees a high sensivity to find stain even on multi wafer.

Stain is detected on the top and the bottom of a wafer.

Short facts:

  • Tailor-made illumination in order to detect stain also on polycrystalline wafers
  • Stain is detected on the whole wafer surface for 100 % quality
  • Top and bottom surface are inspected for higher cell efficiency
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Meyer Burger Technology Group